The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
Jul. 28, 2020
Applicant:
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Inventors:
Assignee:
OSRAM Opto Semiconductors GmbH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2009.12); H01L 31/02 (2005.12); H01L 31/18 (2005.12); H01L 33/32 (2009.12); H01L 33/62 (2009.12); H01L 25/04 (2022.12); H01L 25/075 (2005.12); H01L 25/16 (2022.12);
U.S. Cl.
CPC ...
H01L 33/0095 (2012.12); H01L 31/02005 (2012.12); H01L 31/1848 (2012.12); H01L 31/186 (2012.12); H01L 31/1876 (2012.12); H01L 33/0075 (2012.12); H01L 33/32 (2012.12); H01L 33/62 (2012.12); H01L 25/042 (2012.12); H01L 25/0753 (2012.12); H01L 25/167 (2012.12); H01L 2933/0066 (2012.12);
Abstract
In an embodiment a method for singulating components from a component composite includes providing the component composite comprising a structured substrate including component carrier bodies and connecting portions arranged between the component carrier bodies, and a base material, in which the connecting portions of the structured substrate are at least partially embedded, removing the base material in separating regions of the component composite, which include the connecting portions and singulating the component composite at the separating regions to form the components.