The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
Mar. 11, 2022
Applicant:
Chipletz, Inc., Dover, DE (US);
Inventors:
Michael Su, Austin, TX (US);
Michael Alfano, Austin, TX (US);
Siddharth Ravichandran, Austin, TX (US);
Assignee:
Chipletz, Inc., Spicewood, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2005.12); H01L 23/498 (2005.12); H01L 23/64 (2005.12); H01L 25/16 (2022.12); H10D 1/00 (2024.12); H10D 1/68 (2024.12); H01L 23/00 (2005.12);
U.S. Cl.
CPC ...
H01L 23/642 (2012.12); H01L 23/49816 (2012.12); H01L 23/49822 (2012.12); H01L 23/49838 (2012.12); H01L 25/16 (2012.12); H10D 1/042 (2024.12); H10D 1/043 (2024.12); H10D 1/716 (2024.12); H01L 24/16 (2012.12); H01L 2224/16235 (2012.12);
Abstract
In one aspect, a capacitor or network of capacitors is/are provided for vertical power delivery in a package where the capacitor(s) is/are embedded in or forms the entirety of the package substrate core. In a second aspect, a plurality of thin-film capacitor structures are provided for implementing vertical power delivery in a package. In a third aspect a method is provided for fabricating hermetically sealed thin-film capacitors.