The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Feb. 16, 2021
Applicant:

SK Siltron Co., Ltd., Gyeongsangbuk-do, KR;

Inventors:

Gun Ho Lee, Gyeongsangbuk-do, KR;

Chi Bok Lee, Gyeongsangbuk-do, KR;

Dae Ki Seo, Gyeongsangbuk-do, KR;

Byeong Ha Ko, Gyeongsangbuk-do, KR;

Assignee:

SK SILTRON CO., LTD., Gyeongsangbuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/02 (2005.12); H01L 21/02 (2005.12); H01L 21/67 (2005.12); H01L 21/687 (2005.12);
U.S. Cl.
CPC ...
H01L 21/67051 (2012.12); B08B 3/02 (2012.12); H01L 21/02052 (2012.12); H01L 21/02057 (2012.12); H01L 21/0209 (2012.12); H01L 21/67288 (2012.12); H01L 21/68764 (2012.12);
Abstract

The present invention presents a single wafer-type wafer cleaning device and a single wafer-type method for controlling the surface roughness of a wafer, in which, in a wafer cleaning process, mutually different cleaning processes are carried out on the respective two sides of a wafer, and also, mutually different chemicals are used depending on the side of the wafer being cleaned, thereby enabling the respective roughness of the two sides to differ. The single wafer-type wafer cleaning device comprises a spin chamber, a first chemical supply device, a second chemical supply device and a third chemical supply device.


Find Patent Forward Citations

Loading…