The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Nov. 29, 2021
Applicant:

Mitsubishi Chemical Corporation, Tokyo, JP;

Inventors:

Kenji Iso, Tokyo, JP;

Yuuki Enatsu, Tokyo, JP;

Kenji Shimoyama, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2005.12); C30B 25/20 (2005.12); H01L 29/20 (2005.12);
U.S. Cl.
CPC ...
H01L 21/02389 (2012.12); C30B 25/20 (2012.12); H01L 21/02008 (2012.12); H01L 21/02433 (2012.12); H01L 21/02458 (2012.12); H01L 21/0254 (2012.12); H01L 29/2003 (2012.12);
Abstract

Provided are: a GaN substrate wafer having a crystallinity suitable as a substrate for a semiconductor device as well as an improved productivity; and a method of producing the same. The GaN substrate wafer is a (0001)-oriented GaN substrate wafer that includes a first region arranged on an N-polar side and a second region arranged on a Ga-polar side via a regrowth interface therebetween. In this GaN substrate wafer, the second region has a minimum thickness of not less than 20 μm, the concentration of at least one element selected from Li, Na, K, F, Cl, Br, and I in the first region is 1×10atoms/cmor higher, and the second region satisfies one or more conditions selected from the following (a) to (c): (a) the Si concentration is 5×10atoms/cmor higher; (b) the O concentration is 3×10atoms/cmor lower; and (c) the H concentration is 1×10atoms/cmor lower.


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