The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Oct. 09, 2019
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Tae Ryung Hu, Suwon-si, KR;

Yu Jong Kim, Suwon-si, KR;

Hye Yeon Jeon, Suwon-si, KR;

Young Do Choi, Suwon-si, KR;

Jong Min Lee, Suwon-si, KR;

Seung Hee Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2005.12); H01F 17/00 (2005.12); H01F 27/255 (2005.12); H01F 27/28 (2005.12); H01F 41/04 (2005.12); H01F 3/10 (2005.12); H01F 17/04 (2005.12);
U.S. Cl.
CPC ...
H01F 27/292 (2012.12); H01F 17/0013 (2012.12); H01F 27/255 (2012.12); H01F 27/2804 (2012.12); H01F 41/046 (2012.12); H01F 2003/106 (2012.12); H01F 2017/0066 (2012.12); H01F 2017/048 (2012.12); H01F 2027/2809 (2012.12);
Abstract

A coil electronic component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body in which the support substrate and the coil portion are embedded, and first and second external electrodes disposed on a surface of the body and connected to both ends of the coil portion, respectively. A thickness of the body is 0.55 mm or less. The body includes a cover portion disposed on the coil portion. A ratio of a thickness of the coil portion to a thickness of the cover portion is 5:5 to 8:2.


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