The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Jul. 09, 2021
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Shinji Otani, Nagaokakyo, JP;

Hiroki Imaeda, Nagaokakyo, JP;

Namiko Sasajima, Nagaokakyo, JP;

Tomohiro Sunaga, Nagaokakyo, JP;

Masami Okado, Nagaokakyo, JP;

Yoshimasa Yoshioka, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2005.12); H01F 27/25 (2005.12); H01F 27/255 (2005.12); H01F 41/04 (2005.12);
U.S. Cl.
CPC ...
H01F 27/2804 (2012.12); H01F 27/255 (2012.12); H01F 41/041 (2012.12);
Abstract

An electronic component includes a composite body containing resin and magnetic metal particles, a first metal film provided on an outer surface of the composite body, and a second metal film provided on the first metal film. At least one of the magnetic metal particles is exposed at a contact surface of the composite body that is in contact with the first metal film. The first metal film is in contact with an exposed surface of the at least one of the magnetic metal particles exposed from the contact surface. The film thickness of the first metal film on the exposed surface is 2.9 μm or more.


Find Patent Forward Citations

Loading…