The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
Jul. 21, 2023
Applicant:
Seagate Technology Llc, Fremont, CA (US);
Inventors:
Zubair Ahmed Khan, Villa Park, IL (US);
Dat Quach, Savage, MN (US);
Andrew Habermas, Bloomington, MN (US);
Joel William Hoehn, Hudson, WI (US);
Assignee:
Seagate Technology LLC, Fremont, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/31 (2005.12); B24B 37/04 (2011.12); C09J 7/38 (2017.12); C09J 133/10 (2005.12); C09J 175/04 (2005.12); H01L 21/304 (2005.12); H01L 21/683 (2005.12); C09J 175/08 (2005.12);
U.S. Cl.
CPC ...
G11B 5/3169 (2012.12); B24B 37/048 (2012.12); C09J 7/38 (2017.12); C09J 133/10 (2012.12); C09J 175/04 (2012.12); H01L 21/304 (2012.12); H01L 21/6836 (2012.12); C08G 2170/40 (2012.12); C09J 175/08 (2012.12); C09J 2203/326 (2012.12); C09J 2433/00 (2012.12); C09J 2475/00 (2012.12); H01L 2221/68327 (2012.12);
Abstract
Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.