The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Jun. 24, 2022
Applicants:

Hefei Boe Joint Technology Co., Ltd., Anhui, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Wenchao Bao, Beijing, CN;

Yue Wu, Beijing, CN;

Huihui Li, Beijing, CN;

Miao Liu, Beijing, CN;

Cheng Xu, Beijing, CN;

Jingbo Xu, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G09G 3/3225 (2015.12); G02F 1/1345 (2005.12); G09G 3/32 (2015.12); G09G 3/36 (2005.12); H10K 59/126 (2022.12); H10K 59/131 (2022.12);
U.S. Cl.
CPC ...
G09G 3/3225 (2012.12); G02F 1/13452 (2012.12); G09G 3/32 (2012.12); G09G 3/3648 (2012.12); H10K 59/126 (2023.01); H10K 59/131 (2023.01); G09G 2300/0426 (2012.12); G09G 2310/0291 (2012.12); G09G 2320/0219 (2012.12); G09G 2370/14 (2012.12);
Abstract

A display module includes a display panel, at least one bonding circuit board, a plurality of chip-on-films, and a plurality of buffer devices. The at least one bonding circuit board each include first differential lines, and a first differential line includes a P-polarity differential sub-line and an N-polarity differential sub-line. An end of a chip-on-film is connected to the first differential line, and the other end of the chip-on-film is connected to the display panel. The buffer devices are arranged on the bonding circuit board, a buffer device is connected to ends, proximate to the chip-on-film, of the P-polarity differential sub-line and the N-polarity differential sub-line, and the buffer device is configured to reduce signal reflection between the first differential line and the chip-on-film.


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