The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Jan. 27, 2020
Applicant:

Femtodx, Inc., Beverly Hills, CA (US);

Inventor:

Pritiraj Mohanty, Beverly Hills, CA (US);

Assignee:

FemtoDx, Inc., Beverly Hills, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 33/543 (2005.12); B01L 3/00 (2005.12); B82Y 15/00 (2010.12); G01N 27/12 (2005.12); G01N 27/414 (2005.12);
U.S. Cl.
CPC ...
G01N 33/5438 (2012.12); B01L 3/502715 (2012.12); B82Y 15/00 (2012.12); G01N 27/12 (2012.12); G01N 27/4146 (2012.12); G01N 27/4148 (2012.12); B01L 2300/041 (2012.12); B01L 2300/046 (2012.12); B01L 2300/0627 (2012.12); B01L 2300/0645 (2012.12); B01L 2300/12 (2012.12);
Abstract

The techniques relate to methods and apparatus for sealed fluid chambers. The device includes a sensor chip comprising a set of sensor elements at least partially disposed on a first side of a substrate, wherein each sensor element of the set of sensor elements is configured to sense an analyte and comprises an associated set of through silicon vias (TSVs), each TSV of the set of TSVs extending from an associated portion of the sensor element through the substrate to a second side of the substrate that is opposite the first side. The device includes a fluid chamber proximate to the first side of the substrate and comprising an inner portion in fluid communication with the set of sensor elements, and a sealing member between the fluid chamber and the first side of the substrate.


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