The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
Jan. 05, 2023
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Yohei Mikami, Tokyo, JP;
Tetsuhiro Fukao, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 21/01 (2005.12); H01L 21/67 (2005.12);
U.S. Cl.
CPC ...
G01N 21/01 (2012.12); H01L 21/67248 (2012.12); G01N 2021/0106 (2012.12);
Abstract
A semiconductor laser device () is placed on a first heating-cooling device (). A probe holder () is attached on a second heating-cooling device (). A measurement probe () is fixed to a distal end of the probe holder (). A fine movement table () moves the second heating-cooling device () and the probe holder () so that a distal end of the measurement probe () contacts the semiconductor laser device (). An inspection apparatus () inputs an inspection signal to the semiconductor laser device () through the measurement probe ().