The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Aug. 02, 2022
Applicant:

Tyco Electronics (Shanghai) Co. Ltd., Shanghai, CN;

Inventors:

WenYu (Vindy) Liu, Shanghai, CN;

Xingjie (Steven) Ge, Shanghai, CN;

Xinbo (Polly) Liu, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2005.12); F28F 1/32 (2005.12); F28F 9/00 (2005.12); H05K 7/20 (2005.12);
U.S. Cl.
CPC ...
F28F 1/325 (2012.12); F28F 9/001 (2012.12); G02B 6/4269 (2012.12); H05K 7/20418 (2012.12); F28F 2215/14 (2012.12); F28F 2255/02 (2012.12);
Abstract

A heat dissipation module includes a plurality of heat dissipation units arranged along a longitudinal direction of the heat dissipation module. Each heat dissipation unit has a plurality of heat dissipation fins arranged at intervals along a transverse direction of the heat dissipation module. The heat dissipation fins of a first heat dissipation unit of a pair of adjacent heat dissipation units are each coupled with one of the heat dissipation fins of a second heat dissipation unit of the pair of adjacent heat dissipation units by a coupling structure. The heat dissipation fins of the first heat dissipation unit and the heat dissipation fins of the second heat dissipation unit are displaceable with respect to each other within a certain range.


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