The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
Apr. 12, 2021
Applicant:
Sumitomo Electric Industries, Ltd., Osaka, JP;
Inventors:
Assignee:
Sumitomo Electric Industries, Ltd., Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/18 (2005.12); C23C 16/01 (2005.12); C23C 16/02 (2005.12); C23C 16/27 (2005.12); C25F 3/02 (2005.12); C25F 5/00 (2005.12); C30B 25/20 (2005.12); C30B 29/04 (2005.12); C30B 31/22 (2005.12); C30B 33/04 (2005.12); C30B 33/06 (2005.12); C30B 33/10 (2005.12);
U.S. Cl.
CPC ...
C30B 25/186 (2012.12); C23C 16/01 (2012.12); C23C 16/02 (2012.12); C23C 16/274 (2012.12); C25F 3/02 (2012.12); C25F 5/00 (2012.12); C30B 25/20 (2012.12); C30B 29/04 (2012.12); C30B 31/22 (2012.12); C30B 33/04 (2012.12); C30B 33/06 (2012.12); C30B 33/10 (2012.12); Y10T 428/24479 (2015.01); Y10T 428/2457 (2015.01); Y10T 428/24612 (2015.01);
Abstract
Provided are a diamond composite body capable of shortening a separation time for separating a substrate and a diamond layer, the substrate, and a method for manufacturing a diamond, as well as a diamond obtained from the diamond composite body and a tool including the diamond. The diamond composite body includes a substrate including a diamond seed crystal and having grooves in a main surface, a diamond layer formed on the main surface of the substrate, and a non-diamond layer formed on a substrate side at a constant depth from an interface between the substrate and the diamond layer.