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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12286569 B1

PDFFull Text
Date of Patent:
Apr. 29, 2025

Filed:

Aug. 19, 2019

Adhesive sheet

Applicant:

Nitto Denko Corporation, Ibaraki, JP;

Inventors:

Shusaku Ueno, Ibaraki, JP;

Takumi Yutou, Ibaraki, JP;

Takamasa Hirayama, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Ibaraki, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Frank D Ducheneaux

Int. Cl.
CPC ...
C09J 7/38 (2017.12); C09J 11/08 (2005.12); C09J 125/10 (2005.12); C09J 153/02 (2005.12); H01L 21/304 (2005.12); H01L 21/683 (2005.12);
U.S. Cl.
CPC ...
C09J 7/38 (2017.12); C09J 11/08 (2012.12); C09J 125/10 (2012.12); C09J 153/02 (2012.12); H01L 21/304 (2012.12); H01L 21/6836 (2012.12); C09J 2203/326 (2012.12); C09J 2301/124 (2020.07); C09J 2301/312 (2020.07); C09J 2301/408 (2020.07); C09J 2301/412 (2020.07); C09J 2301/502 (2020.07); C09J 2400/24 (2012.12); C09J 2453/00 (2012.12); H01L 2221/68318 (2012.12); H01L 2221/68327 (2012.12); H01L 2221/6834 (2012.12); H01L 2221/68381 (2012.12);
Abstract

Provided is a pressure-sensitive adhesive sheet that may be used for the grinding of a hard and brittle substrate in a backgrinding step for the hard and brittle substrate, the pressure-sensitive adhesive sheet being excellent in all of grinding accuracy, low contamination property, productivity, and fixing property. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains: a pressure-sensitive adhesive containing a base polymer; and a foaming agent having a foaming temperature of 90° C. or more, and wherein the pressure-sensitive adhesive sheet has, when a pressure-sensitive adhesive surface thereof is bonded to a silicon chip, a shear adhesive strength of 1.0 MPa or more under an ambient temperature of 25° C., and a shear adhesive strength of 0.2 MPa or more under an ambient temperature of 80° C.

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