The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
Nov. 24, 2021
Applicant:
Cpc Corporation, Taiwan, Kaohsiung, TW;
Inventors:
Ching-Hsuan Lin, Taichung, TW;
Wan-Ling Hsiao, Changhua County, TW;
Assignee:
CPC Corporation, Taiwan, Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/10 (2005.12); B32B 15/08 (2005.12); B32B 15/20 (2005.12); B32B 27/28 (2005.12); C08G 73/16 (2005.12); C09D 179/08 (2005.12); H05K 1/03 (2005.12); H05K 1/09 (2005.12);
U.S. Cl.
CPC ...
C08G 73/1071 (2012.12); B32B 15/08 (2012.12); B32B 15/20 (2012.12); B32B 27/281 (2012.12); C08G 73/1042 (2012.12); C08G 73/16 (2012.12); C09D 179/08 (2012.12); H05K 1/0346 (2012.12); B32B 2307/204 (2012.12); B32B 2457/08 (2012.12); H05K 2201/0154 (2012.12); H05K 2201/0355 (2012.12);
Abstract
The present disclosure provides a low-dissipation flexible copper clad laminate, which includes a copper foil and a polyimide film. The polyimide film is attached to the copper foil. The polyimide film includes a polyimide, and the polyimide has a structure represented by formula (I). Formula (I) is defined as in the specification.