The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Dec. 27, 2019
Applicant:

Sumco Corporation, Tokyo, JP;

Inventors:

Yuki Nakano, Saga, JP;

Ryoya Terakawa, Saga, JP;

Takayuki Kihara, Saga, JP;

Hiroki Ota, Saga, JP;

Assignee:

SUMCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2005.12); B24B 37/10 (2011.12); B24B 37/32 (2011.12); H01L 21/306 (2005.12);
U.S. Cl.
CPC ...
B24B 37/32 (2012.12); B24B 37/102 (2012.12); H01L 21/30625 (2012.12);
Abstract

A polishing head includes a first ring-shaped member having an opening; a plate-shaped member that closes the opening on an upper side of the first ring-shaped member; a membrane that closes the opening on a lower side of the first ring-shaped member; a back pad adhered to a lower surface of the membrane; and a second ring-shaped member located below the back pad and having an opening that holds a polishing target workpiece. A space formed by closing the opening of the first ring-shaped member by the plate-shaped member and the membrane includes: a central region; and an outer peripheral region partitioned from the central region by a partition, and an inner peripheral edge region of the second ring-shaped member is located vertically below an outer peripheral edge of the outer peripheral region. A polishing apparatus includes the polishing head, and is used in a method of manufacturing a semiconductor wafer.


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