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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12285839 B1

PDFFull Text
Date of Patent:
Apr. 29, 2025

Filed:

Mar. 09, 2017

Carrier head for chemical mechanical polishing apparatus comprising substrate receiving member

Applicant:

Joon MO Kang, Seongnam, KR;

Inventor:

Joon Mo Kang, Seongnam, KR;

Assignee:
Attorneys:

NKL Law

Jae Youn Kim

Primary Examiner:

Brian D Keller

Assistant Examiner:

Jason Khalil Hawkins

Int. Cl.
CPC ...
B24B 37/27 (2011.12); B24B 37/00 (2011.12); B24B 37/30 (2011.12); B24B 41/00 (2005.12); H01L 21/304 (2005.12); H01L 21/306 (2005.12); H01L 21/463 (2005.12); H01L 21/465 (2005.12); H01L 21/67 (2005.12); H01L 21/673 (2005.12);
U.S. Cl.
CPC ...
B24B 37/27 (2012.12); B24B 37/00 (2012.12); B24B 37/30 (2012.12); B24B 41/002 (2012.12); H01L 21/3043 (2012.12); H01L 21/306 (2012.12); H01L 21/463 (2012.12); H01L 21/465 (2012.12); H01L 21/67 (2012.12); H01L 21/673 (2012.12); H01L 21/67309 (2012.12); H01L 21/67126 (2012.12);
Abstract

A carrier head for a chemical mechanical polishing apparatus comprises: a base; a substrate receiving member comprising a plate portion having an outer surface for receiving a substrate and an inner surface at the back of the outer surface, a perimeter portion extended in a height direction from an edge of the plate portion, a securing portion extended from an outer part of the perimeter portion and connected to a lower part of the base, and a contact portion extended from an inner part of the perimeter portion; a contact coupling structure connected to the lower part of the base to provide a contact surface to the contact portion; and a perimeter portion pressurizing chamber formed by taking the securing portion and the contact portion as chamber walls when the contact portion contacts firmly the contact coupling structure by means of fluid pressure.

Find Patent Forward Citations

Kang, Joon. (2025). Carrier head for chemical mechanical polishing apparatus comprising substrate receiving member (U.S. Patent No. 12285839). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12285839

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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