The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Feb. 27, 2020
Applicant:

Stepan Company, Northfield, IL (US);

Inventors:

Liban Jirmo, Chicago, IL (US);

Ronald A. Masters, Glenview, IL (US);

Assignee:

STEPAN COMPANY, Northfield, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/36 (2005.12); B23K 35/362 (2005.12);
U.S. Cl.
CPC ...
B23K 35/3615 (2012.12); B23K 35/362 (2012.12);
Abstract

Non-aqueous solder flux compositions are disclosed. In some aspects, the compositions comprise: (a) an alkylbenzene sulfonic acid or an acidic phosphate ester; and (b) an alkanolamide, an ethoxylated alkanolamide, an alkanolamine, or an ethoxylated amine. Methods of making solder flux compositions and methods of using the compositions as components of tacky solder fluxes are described. The solder flux compositions have excellent wettability, oxide removal capability, and rheological characteristics for high-speed, pick-and-place manufacturing processes and can be made from a simple combination of two components, thereby avoiding the need for solvents, polymeric thickeners, and other components of traditional tacky solder fluxes.


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