The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2025

Filed:

Nov. 25, 2024
Applicant:

Trumpf (China) Co., Ltd., Taicang, CN;

Inventors:

Feng Feng, Taicang, CN;

Franz Lehleuter, Shanghai, CN;

Yuan Liu, Taicang, CN;

Ke You Chen, Taicang, CN;

Yi Fei, Taicang, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/53 (2013.12); B23K 26/08 (2013.12);
U.S. Cl.
CPC ...
B23K 26/53 (2015.09); B23K 26/0869 (2012.12);
Abstract

A method for the laser machining of a workpiece by using a machining beam is provided. Material modifications are formed in the material along a predetermined machining line by action of the machining beam upon the material. A first group of spaced-apart material modifications is formed in the material, with adjacent material modifications of the first group being formed one after the other in time and having a distance dfrom one another of at least 0.25*λ and/or at most 2.5*λ. A second group of spaced-apart material modifications is formed in the material, with mutually material modifications of the second group being formed one after the other in time and having a distance dfrom one another of at least 0.25*λ and/or at most 2.5*λ. The shortest distance dbetween the material modifications of the first group and the material modifications of the second group being at least 5 μm.


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