The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2025
Filed:
Nov. 17, 2020
Applicant:
Fujikura Ltd., Tokyo, JP;
Inventor:
Kazutoshi Koshimizu, Chiba, JP;
Assignee:
Fujikura Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/04 (2005.12); H05K 1/03 (2005.12); H05K 3/10 (2005.12); H05K 3/12 (2005.12);
U.S. Cl.
CPC ...
H05K 3/048 (2012.12); H05K 1/0353 (2012.12); H05K 3/101 (2012.12); H05K 3/1258 (2012.12); H05K 2201/09118 (2012.12); H05K 2203/0574 (2012.12); H05K 2203/0582 (2012.12);
Abstract
A method for manufacturing a wiring board includes: disposing a first resist material on a substrate; forming a first resist layer by curing the first resist material; forming a resin layer on a release film; forming a conductor portion on the resin layer; covering the conductor portion by disposing a second resist material on the resin layer; forming a second resist layer by curing the second resist material; bringing the first resist layer into contact with the second resist layer, and thereafter bonding the first resist layer and the second resist layer by thermocompression bonding; and releasing the release film from the resin layer.