The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2025
Filed:
Jun. 27, 2021
Applicant:
Byd Company Limited, Guangdong, CN;
Inventors:
Assignee:
BYD COMPANY LIMITED, Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2005.12); C04B 37/02 (2005.12); C23C 22/52 (2005.12); H05K 1/03 (2005.12); H05K 3/38 (2005.12);
U.S. Cl.
CPC ...
H05K 3/022 (2012.12); C04B 37/023 (2012.12); H05K 1/0306 (2012.12); H05K 3/385 (2012.12); C04B 2237/122 (2012.12); C04B 2237/366 (2012.12); C04B 2237/368 (2012.12); C04B 2237/407 (2012.12); C04B 2237/525 (2012.12); C23C 22/52 (2012.12); H05K 2203/0786 (2012.12); H05K 2203/1105 (2012.12);
Abstract
A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.