The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

Jun. 28, 2022
Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Wen Liu, Beijing, CN;

Xu Lu, Beijing, CN;

An Fu, Beijing, CN;

Qing Gong, Beijing, CN;

Zhixin Cui, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2005.12); G09F 9/30 (2005.12); G09F 9/33 (2005.12); H01Q 1/22 (2005.12); H01Q 1/24 (2005.12); H01Q 1/38 (2005.12); H04B 5/43 (2023.12); H05K 1/11 (2005.12); H05K 1/18 (2005.12); H10H 20/857 (2024.12);
U.S. Cl.
CPC ...
H05K 1/118 (2012.12); H01Q 1/243 (2012.12); H01Q 1/38 (2012.12); H04B 5/43 (2023.12); H05K 1/0268 (2012.12); H05K 1/189 (2012.12);
Abstract

The disclosure provides a display module, including a display substrate and a FPC board; the display substrate includes a first base substrate, first bonding terminals, first impedance-test bonding terminals, and an antenna radiation structure; the FPC board includes a second base substrate, second bonding terminals, second impedance-test bonding terminals, and an antenna receiving structure; the first bonding terminals are bonded and connected to the second bonding terminals; the first impedance-test bonding terminals are bonded and connected to the second impedance-test bonding terminals; the antenna radiation structure has two ends respectively connected to two first impedance-test bonding terminals; the antenna receiving structure has two ends respectively connected to two second impedance-test bonding terminals; and the two first impedance-test bonding terminals connected to the antenna radiation structure are respectively bonded and connected to the two second impedance-test bonding terminals connected to the antenna receiving structure in one-to-one correspondence.


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