The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

Nov. 22, 2020
Applicant:

Zf Friedrichshafen Ag, Friedrichshafen, DE;

Inventor:

Thomas Maier, Neunburg v. Wald, DE;

Assignee:

ZF Friedrichshafen AG, Friedrichshafen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2005.12); H05K 1/18 (2005.12); H05K 3/28 (2005.12); H05K 3/30 (2005.12); H05K 3/34 (2005.12);
U.S. Cl.
CPC ...
H05K 1/0209 (2012.12); H05K 1/0256 (2012.12); H05K 1/181 (2012.12); H05K 3/284 (2012.12); H05K 3/303 (2012.12); H05K 3/3415 (2012.12); H05K 2201/066 (2012.12); H05K 2201/09545 (2012.12); H05K 2201/10166 (2012.12); H05K 2201/10977 (2012.12);
Abstract

A power module for the controllable electrical power supply of a consumer includes a plurality of housed power semiconductors each with an electrically non-insulated heat discharge surface, a printed circuit board, a heat sink, one or more insulation plates, wherein the printed circuit board is arranged on a side of the power semiconductor in an orthogonal direction opposite the heat sink, wherein the insulation plate is arranged between the housed power semiconductors and a cooling surface of the heat sink, wherein one insulation plate in each case is interlockingly connected by one side to one electrically non-insulated heat discharge surface of a housed power semiconductor and is interlockingly connected by the other side to the heat sink.


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