The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

Mar. 28, 2022
Applicant:

Lumentum Japan, Inc., Sagamihara, JP;

Inventors:

Masaru Onga, Kanagawa, JP;

Takayuki Nakajima, Tokyo, JP;

Assignee:

Lumentum Japan, Inc., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/042 (2005.12); H01S 5/026 (2005.12); H01S 5/12 (2020.12); H01S 5/22 (2005.12);
U.S. Cl.
CPC ...
H01S 5/04256 (2019.07); H01S 5/026 (2012.12); H01S 5/04252 (2019.07); H01S 5/04254 (2019.07); H01S 5/12 (2012.12); H01S 5/22 (2012.12);
Abstract

A multi-terraced structure includes three or more sections with different thicknesses and adjacent to each other in a direction in which an optical waveguide extends. An adjacent pair of the three or more sections includes one section smaller in thickness and closer to an end face of the semiconductor multilayers and another section larger in thickness and farther from the end face of the semiconductor multilayers. The three or more sections include: a first section with a smallest thickness, including the lowermost layer; a second section adjacent to the first section, including the lowermost layer and additionally a stress relief layer composed of a material equal to or lower than Au in Young's modulus; and a third section with a largest thickness, including all layers from the uppermost layer to the lowermost layer.


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