The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

Jan. 09, 2024
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventors:

Shinji Onduka, Nonoichi Ishikawa, JP;

Akira Ezaki, Nonoichi Ishikawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/417 (2005.12); H01L 21/268 (2005.12); H01L 21/304 (2005.12); H01L 21/3065 (2005.12); H01L 21/78 (2005.12); H01L 29/40 (2005.12); H01L 29/49 (2005.12);
U.S. Cl.
CPC ...
H01L 29/41741 (2012.12); H01L 21/268 (2012.12); H01L 21/78 (2012.12); H01L 29/401 (2012.12); H01L 21/3043 (2012.12); H01L 21/3065 (2012.12); H01L 29/4975 (2012.12);
Abstract

Provided is a semiconductor device including: a substrate containing a semiconductor material; an electrode provided on a substrate surface of the substrate, the electrode containing a metal material; and a mixed member provided on the substrate surface to be in contact with the electrode, the mixed member containing the semiconductor material and the metal material, in which a portion of the substrate surface is exposed at an end of the substrate.


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Onduka, Shinji. (2025). Semiconductor device (U.S. Patent No. 12283614). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12283614

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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