The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2025
Filed:
Jun. 15, 2021
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Jonghae Kim, San Diego, CA (US);
Je-Hsiung Lan, San Diego, CA (US);
Ranadeep Dutta, Del Mar, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2005.12); H01F 17/00 (2005.12); H01L 21/768 (2005.12); H01L 23/48 (2005.12); H01L 23/66 (2005.12); H01L 49/02 (2005.12); H01P 3/08 (2005.12); H01P 11/00 (2005.12);
U.S. Cl.
CPC ...
H01L 28/10 (2012.12); H01F 17/0006 (2012.12); H01F 27/2804 (2012.12); H01L 21/76898 (2012.12); H01L 23/481 (2012.12); H01L 23/66 (2012.12); H01P 3/08 (2012.12); H01P 11/003 (2012.12); H01F 2017/004 (2012.12); H01L 2223/6627 (2012.12); H01L 2223/6672 (2012.12);
Abstract
A three dimensional (3D) inductor is described. The 3D inductor includes a first plurality of micro-through substrate vias (TSVs) within a first area of a substrate. The 3D inductor also includes a first trace on a first surface of the substrate, coupled to a first end of the first plurality of micro-TSVs. The 3D inductor further includes a second trace on a second surface of the substrate, opposite the first surface, coupled to a second end, opposite the first end, of the first plurality of micro-TSVs.