The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2025
Filed:
Apr. 11, 2022
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Atapol Prajuckamol, Thanyaburi, TH;
Chee Hiong Chew, Seremban, MY;
Vemmond Jeng Hung Ng, Senawang, MY;
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2005.12);
U.S. Cl.
CPC ...
H01L 24/40 (2012.12); H01L 24/73 (2012.12); H01L 24/84 (2012.12); H01L 24/32 (2012.12); H01L 2224/32225 (2012.12); H01L 2224/4001 (2012.12); H01L 2224/4007 (2012.12); H01L 2224/40225 (2012.12); H01L 2224/40997 (2012.12); H01L 2224/73263 (2012.12); H01L 2224/84138 (2012.12); H01L 2224/84143 (2012.12); H01L 2224/84345 (2012.12); H01L 2224/84385 (2012.12); H01L 2224/84815 (2012.12); H01L 2924/10272 (2012.12); H01L 2924/13055 (2012.12);
Abstract
According to an aspect, a power electronic module includes a substrate, a semiconductor die coupled to the substrate, and a clip member configured to secure the semiconductor die to the substrate, where the clip member includes a base portion having a surface coupled to the semiconductor die, an extender portion that extends from the base portion, where the extender portion includes a contact portion coupled to the substrate, and at least one protrusion that extends from the base portion or the extender portion.