The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

May. 18, 2020
Applicant:

Pragmatic Semiconductor Limited, Cambridge, GB;

Inventors:

Brian Cobb, Sedgefield Durham, GB;

Richard Price, Sedgefield Durham, GB;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2005.12); H01L 23/367 (2005.12); H01L 23/498 (2005.12); H01L 23/522 (2005.12); H05K 1/18 (2005.12);
U.S. Cl.
CPC ...
H01L 24/19 (2012.12); H01L 23/367 (2012.12); H01L 23/4985 (2012.12); H01L 23/5225 (2012.12); H01L 23/562 (2012.12); H01L 24/05 (2012.12); H01L 24/16 (2012.12); H01L 24/20 (2012.12); H01L 24/32 (2012.12); H01L 24/83 (2012.12); H05K 1/181 (2012.12); H01L 24/81 (2012.12); H01L 24/82 (2012.12); H01L 2224/03318 (2012.12); H01L 2224/04105 (2012.12); H01L 2224/16265 (2012.12); H01L 2224/16268 (2012.12); H01L 2224/2919 (2012.12); H01L 2224/32268 (2012.12); H01L 2224/81203 (2012.12); H01L 2224/81898 (2012.12); H01L 2224/83203 (2012.12); H01L 2224/83851 (2012.12); H01L 2924/30105 (2012.12); H01L 2924/3025 (2012.12); H01L 2924/3511 (2012.12); H01L 2924/3512 (2012.12);
Abstract

There is provided a flexible electronic structure for bonding with an external circuit, comprising a flexible substrate, having a first surface, configured for bonding with the external circuit, and an opposing second surface, configured for engagement with a bonding tool, comprising at least one electronic component; at least one contact member, operatively coupled with said at least one electronic component and provided at said first surface of said flexible substrate, and adapted to operably interface with the external circuit after bonding, and at least one shield member, provided at said first surface so as to shieldingly overlap at least a portion of said at least one electronic component, adapted to withstand a predetermined pressure applied to said first surface and/or said opposing second surface during bonding with the external circuit.


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