The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2025
Filed:
Aug. 07, 2018
Applicant:
Analog Devices International Unlimited Company, Limerick, IE;
Inventors:
Bilge Bayrakci, Istanbul, TR;
Abdullah Celik, Istanbul, TR;
Winslow Round, Amesbury, MA (US);
Santosh Anil Kudtarkar, Ayer, MA (US);
Yusuf Atesal, Istanbul, TR;
Turusan Kolcuoglu, Arlington, MA (US);
Assignee:
Analog Devices International Unlimited Company, Co. Limerick, IE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2005.12); H01L 23/00 (2005.12); H01L 23/14 (2005.12); H01L 23/31 (2005.12); H01L 23/498 (2005.12); H01L 25/065 (2022.12); H05K 1/02 (2005.12); H05K 1/18 (2005.12); H05K 3/32 (2005.12);
U.S. Cl.
CPC ...
H01L 23/66 (2012.12); H01L 23/147 (2012.12); H01L 23/3128 (2012.12); H01L 23/49811 (2012.12); H01L 23/49827 (2012.12); H01L 23/49838 (2012.12); H01L 24/06 (2012.12); H01L 24/13 (2012.12); H01L 24/16 (2012.12); H01L 24/37 (2012.12); H01L 24/45 (2012.12); H01L 25/0657 (2012.12); H05K 1/0243 (2012.12); H05K 1/183 (2012.12); H05K 3/321 (2012.12); H01L 23/49822 (2012.12); H01L 24/05 (2012.12); H01L 24/32 (2012.12); H01L 24/40 (2012.12); H01L 24/48 (2012.12); H01L 24/73 (2012.12); H01L 2223/6611 (2012.12); H01L 2223/6616 (2012.12); H01L 2224/05553 (2012.12); H01L 2224/0557 (2012.12); H01L 2224/06181 (2012.12); H01L 2224/131 (2012.12); H01L 2224/13147 (2012.12); H01L 2224/16145 (2012.12); H01L 2224/16146 (2012.12); H01L 2224/16148 (2012.12); H01L 2224/16157 (2012.12); H01L 2224/16227 (2012.12); H01L 2224/16235 (2012.12); H01L 2224/2929 (2012.12); H01L 2224/293 (2012.12); H01L 2224/40227 (2012.12); H01L 2224/45014 (2012.12); H01L 2224/45015 (2012.12); H01L 2224/45144 (2012.12); H01L 2224/48227 (2012.12); H01L 2224/48465 (2012.12); H01L 2224/48472 (2012.12); H01L 2224/73204 (2012.12); H01L 2224/73207 (2012.12); H01L 2224/73215 (2012.12); H01L 2224/73253 (2012.12); H01L 2224/83104 (2012.12); H01L 2224/92125 (2012.12); H01L 2225/06513 (2012.12); H01L 2225/06541 (2012.12); H01L 2924/10329 (2012.12); H01L 2924/15153 (2012.12); H01L 2924/181 (2012.12); H01L 2924/19107 (2012.12); H05K 3/32 (2012.12);
Abstract
A package is disclosed. The package includes a carrier that comprises a first conductive layer on a first side and a second conductive layer on a second side opposite the first side. The first conductive layer comprises wire bonding pads. The package also includes a semiconductor die that is flip chip mounted on the first side of the carrier.