The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

Jan. 18, 2021
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Hiroshi Ashihara, Toyama, JP;

Motomu Degai, Toyama, JP;

Takayuki Waseda, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2005.12); C23C 16/34 (2005.12); C23C 16/455 (2005.12); C23C 16/52 (2005.12); C23C 16/56 (2005.12); H01L 21/311 (2005.12);
U.S. Cl.
CPC ...
H01L 21/0217 (2012.12); C23C 16/345 (2012.12); C23C 16/455 (2012.12); C23C 16/52 (2012.12); C23C 16/56 (2012.12); H01L 21/0206 (2012.12); H01L 21/02164 (2012.12); H01L 21/02236 (2012.12); H01L 21/31111 (2012.12);
Abstract

Described herein is a technique capable of selectively forming a thin film on a substrate while suppressing damage to other films of the substrate. According to the technique, there is provided a method of manufacturing a semiconductor device, including: (a) removing a natural oxide film from a surface of a substrate by supplying a first inorganic material to the substrate wherein a first film and a second film different from the first film are exposed on the surface of the substrate; (b) forming an oxide film by oxidizing a surface of the first film by supplying an oxidizing agent to the substrate; (c) modifying the surface of the first film by supplying a second inorganic material to the substrate; and (d) selectively growing a thin film on a surface of the second film by supplying a deposition gas to the substrate, wherein (a) through (d) are sequentially performed.


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