The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2025
Filed:
Apr. 06, 2023
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Su Yun Yun, Suwon-si, KR;
Hong Je Choi, Suwon-si, KR;
Ji Hye Han, Suwon-si, KR;
Byung Woo Kang, Suwon-si, KR;
Hye Jin Park, Suwon-si, KR;
Sang Wook Lee, Suwon-si, KR;
Jung Min Kim, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, first and second external electrodes respectively disposed on opposing surfaces of the body and connected to the first internal electrode, and a third external electrode disposed on the body, disposed between the first and second external electrodes and connected to the second internal electrode. One of the first and second external electrodes includes a first conductive resin layer, the first conductive resin layer includes first conductive particles including at least one of a first metal particle and a first intermetallic compound, and a first resin, and a ratio N1/N2 is 17% or more, in which N1 is the number of particles having a Feret diameter of 14 μm or more, among the first conductive particles, and N2 is a total number of first conductive particles.