The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2025
Filed:
Oct. 31, 2022
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Mina Hyun, Suwon-si, KR;
Beomjoon Cho, Suwon-si, KR;
Hyeok Jin Park, Suwon-si, KR;
Won Young Jang, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 2/02 (2005.12); H01G 4/228 (2005.12); H01G 4/30 (2005.12);
U.S. Cl.
CPC ...
H01G 2/02 (2012.12); H01G 4/228 (2012.12); H01G 4/30 (2012.12);
Abstract
An electronic component according to an embodiment includes a multilayer capacitor, a frame terminal, and a conductive bonding portion. An area in which the conductive bonding portion contacts the frame terminal is larger than an area in which it contacts with the external electrode.
Hyun, Mina. (2025). Electronic component (U.S. Patent No. 12283426). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12283426
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile