The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

Nov. 05, 2024
Applicant:

Wuhan University, Hubei, CN;

Inventors:

Hui Li, Hubei, CN;

Xiuhua Li, Hubei, CN;

Shengnan Shen, Hubei, CN;

Assignee:

WUHAN UNIVERSITY, Hubei, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06T 7/557 (2016.12); B22F 10/31 (2020.12); B22F 10/80 (2020.12); B33Y 50/00 (2014.12); G06T 7/00 (2016.12); G06T 7/80 (2016.12); H04N 13/271 (2017.12); H04N 13/282 (2017.12);
U.S. Cl.
CPC ...
G06T 7/557 (2016.12); B22F 10/31 (2020.12); B22F 10/80 (2020.12); B33Y 50/00 (2014.11); G06T 7/0004 (2012.12); G06T 7/80 (2016.12); H04N 13/271 (2018.04); H04N 13/282 (2018.04); G06T 2207/10052 (2012.12); G06T 2207/20081 (2012.12); G06T 2207/20084 (2012.12); G06T 2207/30144 (2012.12);
Abstract

A method and system for 3D contour reconstruction of AM parts based on light field imaging, belonging to the field of image reconstruction technology is provided. The method includes constructing an EPI-UNet framework, where a preset light field dataset is used to construct a training set, learning labels from the disparity maps corresponding to the preset light field dataset are obtained, and EPI-UNet framework is trained to obtain a predicted disparity vector with the training set and learning labels. Two mappings including disparity and depth mapping, and disparity and 3D mapping, are established to get 3D contour of the AM part. The experiments of validation for accuracy and 3D contour reconstruction of AM parts were performed. By applying light field multi-view vision to the AM process and combining the rich angle and spatial domain view information of the light field, this disclosure provides a reliable quality assurance for AM monitoring.


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