The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

Jul. 21, 2020
Applicant:

Compagnie Generale Des Etablissements Michelin, Clermont-Ferrand, FR;

Inventors:

Henri Barguet, Clermont-Ferrand, FR;

Olivier Reix, Clermont-Ferrand, FR;

Gael Pataut, Clermont-Ferrand, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D07B 3/00 (2005.12); D07B 1/06 (2005.12); D07B 7/02 (2005.12);
U.S. Cl.
CPC ...
D07B 3/00 (2012.12); D07B 1/0646 (2012.12); D07B 7/025 (2012.12); D07B 2201/2007 (2012.12); D07B 2201/2021 (2012.12); D07B 2207/204 (2012.12); D07B 2207/4018 (2012.12); D07B 2501/2046 (2012.12);
Abstract

The method makes it possible to manufacture an assembly (A) comprising a layer (C) of metal filamentary elements () wound in a helix. The method comprises a step () of supplying a temporary assembly () comprising a layer () of M'>1 metal filamentary elements () and a temporary centre (), and a step () of separating the temporary assembly () between a first split assembly (), a second split assembly () and the temporary centre (). The method comprises a step () of reassembling the first split assembly () with the second split assembly () so as to form the layer (C) of the assembly (A).


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