Method for preparing a self-supporting substrate from a film base structure comprising a first substrate layer, a first film layer, and a second substrate layer

Abstract

A method for preparing a self-supporting substrate includes: preparing a thin film base structure including a first substrate layer, a thin film layer and a second substrate layer stacked in sequence; removing the first substrate layer from the thin film layer; continuing to grow a material the same as that of the thin film layer on a side of the thin film layer far away from the second substrate layer to prepare a thick film layer; and removing the second substrate layer from the thick film layer and remaining the thick film layer. In the method, a thin film may be grown on a substrate that has a larger diameter, and a thinness of the thin film will not cause the thin film and/or the substrate to crack. Therefore, a thin film that has a large diameter may be obtained so as to obtain a large-sized self-supporting thick film substrate.