The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2025
Filed:
May. 07, 2023
Applicant:
New Mexico Tech University Research Park Corporation, Socorro, NM (US);
Inventors:
Bhaskar S. Majumdar, Socorro, NM (US);
Sherin Bhassyvasantha, Socorro, NM (US);
Luke Soule, Albuquerque, NM (US);
Assignee:
NEW MEXICO TECH UNIVERSITY RESEARCH PARK CORPORATION, Socorro, NM (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/56 (2005.12); C23C 18/31 (2005.12); C25D 3/30 (2005.12); C25D 3/32 (2005.12); C25D 3/60 (2005.12); C25D 5/08 (2005.12); C25D 5/34 (2005.12); C25D 17/10 (2005.12); H05K 3/24 (2005.12);
U.S. Cl.
CPC ...
C25D 3/60 (2012.12); C23C 18/31 (2012.12); C25D 3/30 (2012.12); C25D 3/32 (2012.12); C25D 17/10 (2012.12); H05K 3/24 (2012.12);
Abstract
The disclosure provides a Sn—In electroplating bath that is Pb-free, environmentally safe, operates at room temperature, and does not require changes in existing plating assemblies. Room temperature aging and limited thermal cycling tests show that the electroplated Sn—In alloy film on a Cu substrate effectively mitigates whisker growth.