The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

Sep. 24, 2020
Applicant:

W. L. Gore & Associates, Inc., Newark, DE (US);

Inventors:

Debra K. Born, Flagstaff, AZ (US);

Parikshith K. Kumar, Flagstaff, AZ (US);

Kehinde A. Majolagbe, Flagstaff, AZ (US);

Jared S. Nelson, Flagstaff, AZ (US);

James D. Silverman, Flagstaff, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 14/00 (2005.12); A61B 17/00 (2005.12); A61F 2/01 (2005.12); A61F 2/07 (2012.12); A61F 2/24 (2005.12); C22C 19/00 (2005.12); C22C 19/03 (2005.12); C22F 1/00 (2005.12); C22F 1/10 (2005.12); C22F 1/18 (2005.12);
U.S. Cl.
CPC ...
C22C 14/00 (2012.12); A61B 17/0057 (2012.12); A61F 2/01 (2012.12); A61F 2/07 (2012.12); A61F 2/24 (2012.12); C22C 19/007 (2012.12); C22C 19/03 (2012.12); C22F 1/006 (2012.12); C22F 1/10 (2012.12); C22F 1/183 (2012.12); C22C 2200/00 (2012.12);
Abstract

A wire of a nickel-titanium alloy having a permanent set of less than 5% when 11% strain is applied to the wire is disclosed. The wire may be formed by applying a first heat treatment to the wire, the first heat treatment includes applying heat of a first temperature for a first period of time, applying a strain deformation to the wire to set a shape for the wire during the first heat treatment, and applying a second heat treatment to the wire. The second heat treatment includes applying heat of a second temperature different from the first temperature for a second period of time, and the second temperature is between 210° C. and 290° C. The wire may have a modulus of at least 53 GPa when 200 MPa of stress is applied to the wire, and the wire is bonded to a secondary component.


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