The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2025
Filed:
Jan. 16, 2020
Arizona Board of Regents on Behalf of the University of Arizona, Tucson, AZ (US);
Linan Jiang, Tucson, AZ (US);
Stanley K. H. Pau, Tucson, AZ (US);
Robert A. Norwood, Tucson, AZ (US);
Thomas L. Koch, Tucson, AZ (US);
Arizona Board of Regents on Behalf of the University of Arizona, Tucson, AZ (US);
Abstract
A method of forming an optical interconnect between first and second photonic chips located on an optical printed circuit board (OPCB) includes applying a coupling agent to a bonding surface of a flexible, freestanding polymer waveguide array film having at least one polymer waveguide disposed therein. The waveguide array film is placed onto the first and second photonic chips so that the waveguide array film extends over a gap and/or a step between the first and second photonic chips to thereby form a bonding interface between the bonding surface of the waveguide array film and the first and second photonic chips. The coupling agent is selected such that optical coupling between the first and second photonic chips arises simultaneously with formation of the bonding interface.