The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2025
Filed:
Sep. 20, 2021
Sodick Co., Ltd., Kanagawa, JP;
Masahiro Takano, Kanazawa, JP;
Yuta Yoshida, Kanazawa, JP;
Hiroyasu Miyakawa, Kanazawa, JP;
Shuji Okazaki, Yokohama, JP;
Ichiro Araie, Yokohama, JP;
Yasuyuki Miyashita, Yokohama, JP;
Sodick Co., Ltd., Yokohama, JP;
Abstract
The present invention provides a system capable of estimating a molding state in a manufacturing process of the lamination molded object. According to the present invention, provided is a system for estimating a molding state in a manufacturing process of the lamination molded object including an image acquisition unit and an analysis unit. The lamination molded object is manufactured by repeating a material layer forming step of forming a material layer by supplying material powder onto a molding region and a solidified layer forming step of forming a solidified layer by irradiating the material layer with a laser beam. The image acquisition unit is configured to acquire image data of a spatter generated around a molten pool formed by irradiation with the laser beam. The analysis unit is configured to analyze the image data to estimate a parameter representing the molding state.