The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2025
Filed:
Oct. 28, 2020
South China University of Technology, Guangzhou, CN;
Huazhong University of Technology, Wuhan, CN;
Jilin University, Changchun, CN;
Yuanyuan Li, Guangzhou, CN;
Chao Yang, Guangzhou, CN;
Xuan Luo, Guangzhou, CN;
Dongdong Li, Changchun, CN;
Yanguo Qin, Changchun, CN;
Ning Li, Wuhan, CN;
South China University of Technology, Guangzhou, CN;
Abstract
The present invention relates to a Si-containing high-strength and low-modulus medical titanium alloy, and an additive manufacturing method and use thereof. The additive manufacturing method comprises alloy ingredient design, powder preparation, model construction and substrate preheating, and additive manufacturing molding; wherein the Si-containing high-strength and low-modulus medical titanium alloy is designed in the ingredient proportion of Ti 60-70 at. %, Nb 16-24 at. %, Zr 4-14 at. %, Ta 1-8 at. %, Si 0.1-5 at. %. The principle of the present invention is design of a medical β-type titanium alloy having high-strength and low-modulus and good biocompatibility by using d-electron theory; reducing the difference of thermal expansion between the silicide and the β-Ti phase by preheating, and at the same time, ensuring that there is a sufficient degree of cooling in the additive manufacturing process to promote the transition of the alloy from the divorced eutectic reaction to the precipitation reaction, thereby solving the common problems, such as the deterioration of mechanical properties caused by the continuous distribution of the Si-containing phase along the grain boundary and the cracking caused by the difference of thermal expansion coefficient between different phases.