The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Sep. 26, 2022
Applicant:

Prime World International Holdings Ltd., New Taipei, TW;

Inventors:

Ling-An Kung, New Taipei, TW;

Yu Chen, New Taipei, TW;

Che-Shou Yeh, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2005.12); G02B 6/42 (2005.12); H05K 5/00 (2005.12); H05K 7/20 (2005.12);
U.S. Cl.
CPC ...
H05K 1/0203 (2012.12); G02B 6/4268 (2012.12); H05K 5/0047 (2012.12); H05K 7/2039 (2012.12); H05K 7/20445 (2012.12);
Abstract

An optical transceiver includes housing, circuit board, first heat source, second heat source, first heat conductive component and second heat conductive component. The housing includes a first housing and a second housing that are stacked on each other and together form an accommodation space. The circuit board is disposed in the accommodation space. The first heat source and the second heat source are disposed on and electrically connected to the circuit board. The first heat conductive component is disposed in the circuit board and thermally coupled to the first housing. A part of the circuit board is located between the first heat conductive component and the first heat source. The second heat conductive component is disposed on the circuit board. The second heat source is thermally coupled to the second heat conductive component. The second heat conductive component is thermally coupled to the second housing.


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