The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Mar. 12, 2023
Applicant:

Semiconductor Components Industries, Llc, Scottsdale, AZ (US);

Inventors:

Jhankar Malakar, Corvallis, OR (US);

Arindam Raychaudhuri, Bangalore, IN;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 25/766 (2022.12); H04L 7/00 (2005.12); H04N 25/76 (2022.12); H04N 25/767 (2022.12);
U.S. Cl.
CPC ...
H04N 25/766 (2022.12); H04N 25/767 (2022.12); H04N 25/7795 (2022.12); H04L 7/0087 (2012.12);
Abstract

Imaging circuitry may include half-driver sub-circuits configured to support Mobile Industry Processor Interface (MIPI) D-PHY mode and C-PHY mode. Groups of two half-driver sub-circuits can be coupled together in the D-PHY mode, whereas groups of three half-driver sub-circuits can be coupled together in the C-PHY mode. Each half-driver sub-circuit can include one or more pull-up paths and one or more pull-down paths. Each half-driver sub-circuit can include multiple slices, a first portion of which can be operated to pull in a first direction and a second portion of which can be operated to pull in a second direction opposing the first direction to achieve the desired amount of equalization. The half-driver sub-circuits can be employed as the final driver stage of a shared data path architecture supporting both D-PHY and C-PHY modes. The shared data path can include serializers, pre-driver logic, and/or equalization enable blocks.


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