The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Jan. 03, 2024
Applicant:

Soitec, Bernin, FR;

Inventors:

Djamel Belhachemi, Saint Martin d'Heres, FR;

Thierry Barge, Bernin, FR;

Assignee:

SOITEC, Bernin, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 3/10 (2005.12); C09J 7/30 (2017.12); H03H 9/02 (2005.12); H03H 9/25 (2005.12); H03H 9/64 (2005.12); H10N 30/073 (2022.12); H10N 30/08 (2022.12); H10N 30/082 (2022.12); H10N 30/086 (2022.12);
U.S. Cl.
CPC ...
H03H 3/10 (2012.12); C09J 7/30 (2017.12); H03H 9/02574 (2012.12); H03H 9/02834 (2012.12); H03H 9/02897 (2012.12); H03H 9/25 (2012.12); H03H 9/6489 (2012.12); H10N 30/073 (2023.01); H10N 30/08 (2023.01); H10N 30/082 (2023.01); H10N 30/086 (2023.01);
Abstract

A process for fabricating a substrate for a radiofrequency device includes providing a piezoelectric substrate and a carrier substrate, depositing a dielectric layer on a surface of the piezoelectric substrate, assembling together the piezoelectric substrate and the carrier substrate with a polymerizable adhesive directly between the dielectric layer and the carrier substrate to form an assembled substrate, and polymerizing the polymerizable adhesive layer to form a polymerized layer bonding the piezoelectric substrate to the carrier substrate, the polymerized layer and the dielectric layer together forming an electrically insulating layer between the piezoelectric substrate and the carrier substrate.


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