The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Sep. 24, 2024
Applicant:

Nuvoton Technology Corporation Japan, Kyoto, JP;

Inventors:

Akihiko Nishio, Ishikawa, JP;

Katsuhiko Kawashima, Hyogo, JP;

Yusuke Kanda, Toyama, JP;

Takashi Yui, Shiga, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/195 (2005.12); H01L 23/66 (2005.12); H03F 3/21 (2005.12); H10D 30/01 (2024.12); H10D 30/47 (2024.12); H10D 64/00 (2024.12); H10D 64/27 (2024.12);
U.S. Cl.
CPC ...
H03F 3/21 (2012.12); H01L 23/66 (2012.12); H03F 3/195 (2012.12); H10D 30/015 (2024.12); H10D 30/475 (2024.12); H10D 64/111 (2024.12); H10D 64/411 (2024.12); H01L 2223/6616 (2012.12);
Abstract

A power amplifier semiconductor device includes: a substrate; a semiconductor layer provided on the surface of the substrate and including a plurality of unit HEMTs; a connection layer provided on the semiconductor layer and including a source electrode, a drain electrode, and a gate electrode of each of the plurality of unit HEMTs; a terminal layer provided on the connection layer; a back electrode which is provided on the bottom surface of the substrate and whose potential is set to a source potential; and substrate vias that pass through the substrate and have a shield wiring layer on inner walls of the substrate vias. In plan view, either one of the drain aggregation portion or the gate aggregation portion is or both of the drain aggregation portion and the gate aggregation portion are each surrounded by the substrate vias.


Find Patent Forward Citations

Loading…