The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Apr. 11, 2019
Applicant:

Mitsui High-tec, Inc., Fukuoka, JP;

Inventors:

Shigeru Nagasugi, Fukuoka, JP;

Takashi Fukumoto, Fukuoka, JP;

Jin Oda, Fukuoka, JP;

Assignee:

MITSUI HIGH-TEC, INC., Fukuoka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02K 15/02 (2024.12); B32B 15/01 (2005.12); C21D 9/00 (2005.12); H01F 41/14 (2005.12);
U.S. Cl.
CPC ...
H02K 15/02 (2012.12); B32B 15/011 (2012.12); C21D 9/0068 (2012.12); H01F 41/14 (2012.12); H02K 2201/09 (2012.12); Y10T 29/49012 (2015.01);
Abstract

A method for manufacturing a laminated body includes: laminating an electromagnetic steel plate to form the laminated body; performing an annealing process on the laminated body; acquiring a before-annealing lamination thickness information on a thickness of the laminated body before performing the annealing process on the laminated body; and when the before-annealing lamination thickness information does not satisfy a before-annealing criterion which is predetermined, adjusting a lamination condition of the electromagnetic steel plate such that the before-annealing lamination thickness information satisfies the before-annealing criterion.


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