The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2025
Filed:
Sep. 03, 2019
Samtec, Inc., New Albany, IN (US);
Marc Epitaux, Gland, CH;
Eric J. Zbinden, Santa Clara, CA (US);
John Coronati, Colorado Springs, CO (US);
Jignesh H. Shah, Santa Clara, CA (US);
Brandon Thomas Gore, Lexington, SC (US);
SAMTEC, INC., New Albany, IN (US);
Abstract
This present disclosure increases the interconnect density by using a different technology approach than the industry is currently using (stamping and molding). By using a MEMS-based technology approach, better geometry and impedance control can be carried out to reduce impedance discontinuities and feature size. Additional concepts include low connector insertion force, no contact wiping, and a precise alignment mechanism between the connector contacts and those on the mating substrate.