The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Nov. 26, 2020
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventor:

Thomas Schwarz, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2005.12); H01L 25/075 (2005.12); H01L 31/12 (2005.12); H01L 33/54 (2009.12); H01L 33/62 (2009.12);
U.S. Cl.
CPC ...
H01L 33/62 (2012.12); H01L 25/0753 (2012.12); H01L 33/54 (2012.12); H01L 2933/005 (2012.12); H01L 2933/0066 (2012.12);
Abstract

The invention relates to a component with a support and a plurality of semiconductor chips, in which the support has a single-ply, electrically conducting support layer, wherein the support layer is structured and has a plurality of sublayers. The support layer has a mounting surface, on which the semiconductor chips are arranged, wherein the semiconductor chips are mechanically supported by the support layer and electrically conductively connected to the sublayers. The support has a common electrode for semiconductor chips of a group of a plurality of semiconductor chips, wherein the common electrode is formed by one of the sublayers or by a plurality of electrically connected sublayers of the support layer. The invention further relates to a method for producing a component of this kind.


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