The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2025
Filed:
Apr. 25, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Bongjin Son, Asan-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
Provided are an image sensor package with improved reliability and a method of fabricating the same. The image sensor package includes a package substrate, an image sensor chip mounted on the package substrate, a transparent cover on the image sensor chip, an encapsulant encapsulating the image sensor chip and covering a side surface of the transparent cover, a dam on a surface of the image sensor chip and surrounding a portion of the upper surface of the image sensor, the transparent cover on the dam, a bonding wire connecting a chip pad of the image sensor chip to a substrate pad of the package substrate, the dam covering a first end of the bonding wire connected to the chip pad, and a stress reducing layer covering a second end of the bonding wire connected to the substrate pad, the stress reducing layer including substantially the same material as the dam.