The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2025

Filed:

Jun. 24, 2021
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Xinhong Lu, Beijing, CN;

Xiaoyan Zhu, Beijing, CN;

Chao Liu, Beijing, CN;

Shuilang Dong, Beijing, CN;

Jiushi Wang, Beijing, CN;

Liuqing Li, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2005.12); H01L 25/16 (2022.12); H01L 33/62 (2009.12);
U.S. Cl.
CPC ...
H01L 25/0753 (2012.12); H01L 25/167 (2012.12); H01L 33/62 (2012.12); H01L 2933/0066 (2012.12);
Abstract

A driving substrate, a light-emitting apparatus and a manufacturing method thereof, a splicing display apparatus, the driving substrate includes: a device disposing area, a bending area and a bonding area, the bending area is located between the device disposing area and the bonding area; the driving substrates located in the device disposing area, the bending area, and the bonding area include a buffer layer, a first conductive layer and a flexible dielectric layer that are stacked in sequence; the driving substrates located in the device disposing area and the bonding area further include a base plate disposed at a side of the buffer layer away from the first conductive layer, and a second conductive layer disposed at a side of the flexible dielectric layer away from the first conductive layer; and the driving substrate located in the bending area is configured to be able to bend along a bending axis.


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