The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2025
Filed:
Feb. 28, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventor:
Yong-durk Kim, Hwaseong-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/392 (2019.12); G06F 30/394 (2019.12); H01L 23/522 (2005.12); H01L 23/528 (2005.12);
U.S. Cl.
CPC ...
H01L 23/5283 (2012.12); G06F 30/392 (2019.12); G06F 30/394 (2019.12); H01L 23/5226 (2012.12); H01L 23/528 (2012.12); H01L 23/5286 (2012.12);
Abstract
An integrated circuit (IC) includes a via stack, and the via stack includes via arrays including a plurality of vias at the same level. A plurality of vias of a via array are arranged at intersections between tracks of adjacent conductive layers and arranged along a central line between the tracks. Also, a via overlap extends parallel to tracks of a conductive layer. Thus, the number of tracks sacrificed by the via array may be reduced, and the IC may have enhanced performance and a reduced area due to improved routability.