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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12278170 B1

PDFFull Text
Date of Patent:
Apr. 14, 2025

Filed:

Jun. 21, 2022

Semiconductor module, electrical component, and connection structure of the semiconductor module and the electrical component

Applicants:

Denso Corporation, Kariya, JP;

Toyota Jidosha Kabushiki Kaisha, Toyota, JP;

Mirise Technologies Corporation, Nisshin, JP;

Inventors:

Hiroshi Ishino, Nisshin, JP;

Hirokazu Sampei, Nisshin, JP;

Katsuya Kumagai, Nisshin, JP;

Koji Doi, Nisshin, JP;

Assignees:

DENSO CORPORATION, Kariya, JP;

TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota, JP;

MIRISE Technologies Corporation, Nisshin, JP;

Attorney:

Posz Law Group, PLC

Primary Examiner:

John A Bodnar

Int. Cl.
CPC ...
H01L 23/495 (2005.12); H01L 23/31 (2005.12);
U.S. Cl.
CPC ...
H01L 23/49575 (2012.12); H01L 23/3107 (2012.12); H01L 23/49548 (2012.12);
Abstract

A semiconductor module includes a resin molded part encapsulating a semiconductor chip, a first terminal having a plate shape, and a second terminal having a plate shape. The first terminal and the second terminal are disposed on top of the other in a thickness direction. The first terminal is exposed from a first surface of the resin molded part, and the second terminal is projected from a second surface of the resin molded part to an outside of the resin molded part, the second surface being different from the first surface from which the first terminal is exposed.

Find Patent Forward Citations

Ishino, Hiroshi. (2025). Semiconductor module, electrical component, and connection structure of the semiconductor module and the electrical component (U.S. Patent No. 12278170). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12278170

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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